Modern Electroplating 5 ed.
Schlesinger M. (ed.), Paunovic M. (ed.)Schlesinger M. (ed.) Modern Electroplating 5 ed. 2010 [pdf 737sc 729c. 82.30mb]
Preface.
Preface to The Fourth Edition.
Conversion Factors.
Graphical Conversion.
The Electrochemical Society Series.
Fundamental Considerations
Electrodeposition of Copper
Electrodeposition of Nickel
Electrodeposition of Gold
Electroless and Electrodeposition of Silver
Tin and Tin Alloys for Lead-Free Solder
Electrodeposition of Chromium
Electrodeposition of Lead and Lead Alloys
Electrodeposition of Tin?Lead Alloys
Electrodeposition of Zinc and Zinc Alloys
Electrodeposition of Iron and Iron Alloys
Palladium Electroplating
Electrochemical Deposition Process for ULSI Interconnection Devices
Electrodeposition of Semiconductors
Deposition on Nonconductors.
Conductive Polymers: Electroplating of Organic Films
Electroless Deposition of Copper
Electroless Deposition of Nickel
Electrochemical Synthesis of Metal Alloys for Magnetic Recording Systems
Electroless Deposition of Palladium and Platinum
Electroless Deposition of Gold
Electroless Deposition of Alloys
Preparation for Deposition
Manufacturing Tools
Monitoring and Control
Environmental Aspects of Electrodeposition
Applications to Magnetic Recording and Microelectronic Technologies
Microelectromechanical Syste
Κατηγορίες:
Έτος:
2010
Έκδοση:
5
Εκδότης:
John Wiley & Sons, Inc., Hoboken, New Jersey
Γλώσσα:
english
Σελίδες:
737
Αρχείο:
PDF, 82.30 MB
IPFS:
,
english, 2010